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THE TECHEXPO BUYERS' GUIDE FOR HI-TECH PRODUCTS & SERVICES


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Polymers, Plastics PRODUCTS
MATERIALFEATURESVENDOR
Epoxy & Urethane Molded PartsVacuum / pressure processor of single or two component liquid thermoset resinsFarad Industries, Inc.
NoSweep™ Wire Bond Encapsulant Cat. No. EW7073A novel, 100% solids, single component, filled liquid designed for encapsulation of semiconductor devices comprising wire bonds with very narrow diameters, long wires, and ultra fine pitch.Polysciences, Inc.
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