Teledyne DALSA brings its high speed multi-line color Piranha XL cameras to Vision China
High quality CMOS TDI line scan cameras, low-cost vision sensors and high-speed, feature-rich GigE Vision area cameras featured in demonstrations on booth N2-2200
SHANGHAI, China – March 7, 2017 - Teledyne DALSA, a Teledyne Technologies company and global leader in image sensing technology, will demonstrate its high value capabilities with “live” in-booth demonstrations at Vision China, in booth N2-2200, March 14-16, at the Shanghai New International Expo Center.
Following are some of the products featured:
About Teledyne DALSA
- Piranha XL color CMOS TDI line scan cameras provide an unprecedented combination of speed, resolution, and responsivity with low noise color imaging. New 8 and 16k models deliver high sensitivity using 4 rows per RGB channel for 12 rows in total and employ the industry’s most advanced CMOS sensor architecture, achieving data throughput of up to 5 Gbytes/second on a single CX4 cable.
- The new Linea monochrome line scan camera employs a 16k single line 3.5 µm x 3.5 µm pixel array at a 71 kHz maximum line rate with a Camera Link HS interface. Compact and light-weight, this latest model features flat-field correction, multiple ROI and AOI, multiple user configuration sets, and calibration coefficients for various lighting conditions.
- BOA Spot vision sensors combine the power and flexibility of a vision system with integrated LED lighting, lens cover, and easy-to-use software. Fast and robust, these new vision sensors can decode 1D barcodes with bar widths and spacing down to 1.5 pixels; and 2D matrix codes with cell or dot sizes down to 2 pixels. Simple, affordable and reliable inspection for a range of error-proofing applications.
- Genie Nano cameras feature the industry’s most powerful color and monochrome image sensors. With more than 40 models to choose from, low-cost Nano models are available in resolutions from VGA to 25 Mpixels, with a GigE Vision or Camera Link interface and serve applications that include intelligent transport systems (ITS), food and printed circuit board (PCB) inspection.
Teledyne DALSA is located in booth #2200, Hall N2. Stop by, meet the team and learn more about the industry’s most advanced imaging technologies.
Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-Ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada.
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